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요약
輝達執行長黃仁勳日前提出資料中心「五層蛋糕」理論之後，台積電昨（14）日提出「AI三層蛋糕」概念，強調未來AI晶片將朝向「Compute（邏輯運算）」、「3D Integration（3D堆疊）」、「Photonics（光學傳輸）」等三方面整合進展。
본문
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