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因應AI需求動能強勁，為擴大支持半導體產業投資，土地銀行今天宣布統籌主辦「合晶科技新臺幣45億元聯貸案」完成募集，並簽訂聯合授信合約，力挺合晶科技擴大12吋晶圓產能，深耕半導體產業。
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If you click 'Accept all', we and our partners, including 251 who are part of the IAB Transparency & Consent Framework, will also store and/or access information on a device (in other words, use …