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Intel's senior vice president, Cho Min-sung, announced at the Semiconductors Powering Humanoids summit in South Korea that the next-generation "Razor Lake-AX" platform will be a computing powerhouse, featuring 700 TOPS of AI compute on die. This means that at…
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Sunday, October 18th 2026
Intel "Razor Lake-AX" to Pack 700 TOPS of AI Compute
by AleksandarK
Yesterday, 01:53
Discuss (9 Comments)
Intel's senior vice president, Cho Min-sung, announced at the Semiconductors Powering Humanoids summit in South Korea that the next-generation "Razor Lake-AX" platform will be a computing powerhouse, featuring 700 TOPS of AI compute on die. This means that at INT8/FP8 precision, "Razor Lake-AX" will outperform the current "Panther Lake" mobile chips by 3.88 times, which have a total compute power of 180 TOPS. This represents a significant boost in compute power for the SoC, primarily derived from a large integrated GPU alongside a substantial CPU complex. Earlier reports indicated that the "Razor Lake-AX" iGPU will be available in two versions: one with a 16-core iGPU and a flagship SKU with a 32-core iGPU.Both of these integrated graphics solutions are expected to be based on Intel's Xe3 graphics IP, currently found in "Panther Lake." This would make "Razor Lake-AX" nearly three times as powerful as the current Arc B390, which powers Intel's PTL lineup. This suggests that "Razor Lake-AX" will be a large package, as the GPU die is reportedly around 162.84 mm². We also learned that Intel plans to reintroduce on-package memory with the upcoming "AX" chip. Although the company initially stated that the Core Ultra 200V "Lunar Lake" was the last design with on-package memory, Intel is reportedly bringing back on-package LPDDR5X/LPDDR6 memory for "Razor Lake-AX." Do note that the image below is simply an illustration.
Additionally, it's unclear where Intel will manufacture this massive chip, but the large iGPU suggests a design powered by EMIB and Foveros 3D to interconnect various elements. Finally, the chip is expected to feature a BGA-4326 package with 4,326 pins, similar to what Intel's Xeon CPUs typically use. Previously, Intel was considering a "Nova Lake-AX" SoC featuring 48 Xe3 cores paired with a 28-core CPU cluster. However, this has been put on hold, and the "AX" generation will not debut with the upcoming "Nova Lake" generation. Intel plans to launch the first batch of chips with the "AX" suffix after "Nova Lake," with "Razor Lake-AX" expected to arrive in 2028.
Source:
The Elec
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9 Comments on Intel "Razor Lake-AX" to Pack 700 TOPS of AI Compute
#1 Sounds like a Bugatti for the desktop 🫦 #2 2028, i wonder if we will still be alive or if a Claude using agent killed us by then. #3kondamin2028, i wonder if we will still be alive or if a Claude using agent killed us by then.No AI is remotely capable of that...however dumbass people following dumbass AI might #4
AleksandarKBoth of these integrated graphics solutions are expected to be based on Intel's Xe3 graphics IP, currently found in "Panther Lake."I believe these are expected to be Xe3P not Xe3. #5
ZoneDymoNo AI is remotely capable of that...however dumbass people following dumbass AI mightSome agent hacking into some computer that is holding back toxic sludge from being released in the wider environment.
flush, oceans contaminated, planet dead. #6
kondaminSome agent hacking into some computer that is holding back toxic sludge from being released in the wider environment.No AI can even do that, that is all just advertisement nonsense. #7
flush, oceans contaminated, planet dead.
ZoneDymoNo AI can even do that, that is all just advertisement nonsense.Oh they can, it just takes a long time and costs a heck of a lot of resources #8
kondaminOh they can, it just takes a long time and costs a heck of a lot of resourcesAdmin
Pasword123
That is connected to the public Internet and controls it might be the bigger issue? #9
evilpaulAdminThat is an issue.
Pasword123
That is connected to the public Internet and controls it might be the bigger issue?