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요약
AI半導體需求爆發驅動先進封裝技術快速演進，面板級封裝（FOPLP）成為各方角力的新戰場，根據集邦科技（TrendForce）分析，台積電（2330）短期聚焦CoPoS（Chip-on-Panel-on-Substrate）並鎖定310×310毫米（mm）基板尺寸，2026年為相關設備與材料商的驗證
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